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Full-Day Workshop – IMAS 2024
IMAS 2024
IMAS 2024
  • International Microwave & Antennas Symposium (IMAS 2024) October 21-24, 2024 I Marrakech, Morocco
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Advancements in Power Amplifier Design and High-Frequency Electronic Devices for Modern Communication Systems

Title: “Mastering Power Amplifier Design: Essential Principles”
Abstract:

Dr. Ali Darwish will provide an in-depth exploration of power amplifier design, starting from foundational concepts to advanced design techniques. The session will cover power basics, device technologies (GaN, GaAs, InP, Si, and SiGe), and device structures (MESFET, pHEMT, HEMT, HBT, and LDMOS). Attendees will learn about stability, load-pull characterization, and the design of various PA classes (A, B, AB, C, D, E, F, and inverse F), providing a holistic view of conventional and high-efficiency PA design.

Title: “Fundamentals of RF and mm-Wave Power Amplifiers”
Abstract:
Dr. Hua Wang’s presentation will focus on mm-wave power-amplifier designs in silicon, including PA performance metrics, active devices, passive networks, and power combining strategies. The tutorial will discuss advanced architectures like Doherty and Hybrid PAs, addressing challenges and state-of-the-art examples in high mm-Wave PAs for beyond-5G/6G applications.

Title: “Advances on Millimeter-Wave Integrated Power Amplifiers for Massive MIMO Wireless and Satellite Communications”
Abstract:
Prof. Slim Boumaiza will discuss the challenges of designing high-frequency integrated circuit power amplifiers for massive MIMO systems. The session will introduce an electromagnetic/RF and DSP co-simulation framework for massive MIMO transmitters and explore PA designs at 28 GHz and 40 GHz, focusing on enhancing linearity and efficiency under modulated signals affected by antenna crosstalk.

Title: “Electronic Devices for Next Generation High-Frequency Applications”
Abstract:
Dr. Dimitris Pavlidis will explore advanced materials and novel concepts in next-generation electronic devices, emphasizing Wide Bandgap and Ultra-Wide Bandgap semiconductors. The presentation will cover device designs like FEDs and III-Nitride HEMTs, examining their electrical characteristics, thermal properties, and potential for operation in extreme environments.

Title: “Linear Microwave Power Amplifiers for Modern Complex Communications Waveforms”
Abstract:
Dr. Gamal Hegazi’s workshop will focus on designing microwave power amplifiers for complex waveforms such as APSK, QAM, and OFDM, which offer improved spectral efficiency but pose significant design challenges. The session will delve into techniques for mitigating distortion in amplifiers for modern communication systems.

Title: “Advancements in mm-Wave and Sub-THz Load-Pull Techniques for Next-Generation Communication and Radar Systems”
Abstract:
Dr. Zacharia Ouardirhi will discuss mm-Wave and sub-THz frequency bands as enablers for next-gen communication and radar systems. The talk will review large-signal operation and load-pull techniques, highlighting their applications in device characterization, model verification, and performance assessment of power amplifiers up to 350 GHz.

Title: “Packaging Technologies for Millimeter-Wave and Sub-Terahertz Systems”
Abstract:
Dr. Telesphor Kamgaing will cover recent developments in packaging technologies for mm-wave and sub-terahertz systems. The presentation will discuss integration techniques, passive circuits, and examples of fully packaged transceivers on advanced CMOS technology nodes, essential for meeting the demands of next-generation wireless communication standards.

This workshop explores the evolving challenges and advancements in designing microwave and millimeter-wave power amplifiers for modern communication systems. Beginning with foundational concepts, such as Shannon’s limit on communication channel capacity, the workshop delves into the design intricacies of amplifiers handling complex waveforms like Amplitude Phase Shift Keying (APSK), Quadrature Amplitude Modulation (QAM), and Orthogonal Frequency Division Multiplexing (OFDM). These waveforms, characterized by non-constant envelope properties, offer improved spectral efficiency but introduce significant design challenges requiring advanced techniques to mitigate distortion.

In addition, the workshop will cover advancements in millimeter-wave integrated power amplifiers for massive MIMO wireless and satellite communications, discussing the challenges in designing high-frequency integrated circuits for these applications. The focus will be on the use of electromagnetic/radio frequency and digital signal processing co-simulation frameworks to improve the design and performance analysis of power amplifiers, particularly in dealing with active load modulation caused by antenna crosstalk.

 Further, the workshop will address next-generation electronic devices, highlighting the potential of Wide Bandgap and Ultra-Wide Bandgap semiconductors to enhance power performance and explore new device designs, such as field emitter devices (FEDs). Special attention will be given to the characteristics and applications of advanced materials like III-Nitrides in these devices.